eia-rs481 (equivalent to iec 286, part 3). fuses are orientated in embossed pockets with ceramic side facing up to facilitate proper mounting (see ?lectrical characteristics? general note 4.) product rated current symbol package code tr/ 3,000 pcs., on a 178mm reel, 8mm tape width sp/ 50 pcs. on tape in a plastic box tr1/ 15,000 pcs., on a 330mm reel, 8mm tape width (see table) 3216FF smt chip fuse 3216FF subminiature surface mount fuses form no. 3216FF page 1 of 2 bif doc #3001 bussmann general information: bussmann smt chip fuses utilize metal film and ultrasonic wire bond technologies for superior fusing action and enhanced reliability. the fuse element is bonded to a ceramic substrate and encapsulated with green-colored glass, providing excellent short-circuit performance and environmental integrity. substrate and coating thermal expansion coefficients are closely matched to that of fr-4 epoxy-glass circuit board for superior joint reliability. the end terminations are over-plated with nickel and tin- lead. time-current characteristics fast acting fuse: will carry 100% of rated current for a minimum of 4 hours, and will open within 5 seconds at 250% of rated current (250ma-3a). the 4-6.5a fuses will open within 1 second at 350% of rated current. packaging & ordering information: tape and reel: standard 8mm tape, in compliance with 1.60 0.2 (0.063 0.008) mm (inches) 3.20 0.2 (0.126 0.008) 0.50 0.25 (0.020 0.010) 1a 0.90 + 0.20, -0.15 (0.035 + 0.008, -0.006) catalog symbol: 3216FF voltage rating: 32 volt ac, 63 volt dc (250ma-3a) 32 volt ac, 32 volt dc (4-6.5a) interrupting rating: 50 amp ac/dc physical size: eia socm-3216ac (equivalent to 1206) 3.2 ? 1.6 ? 0.90mm 0.126 ? 0.063 ? 0.035 in. agency approvals: ul recognized, std. 248-14 all ratings - file e19180, guide jdyx2 csa certified: 1.5-3a - file 53787, class 1422-01 csa component acceptance 250ma,1a, 4-6.5a - file 53787, class 1422-30 dimensional data r r rev. a e99039 9-7-99 ce logo denotes compliance with european union low voltage directive (50-1000 vac, 75-1500 vdc). refer to bif document #8002 or contact bussmann application engineering at 636-527-1270 for more information. electrical characteristics current mark typical melting typical total typ. resistance typ. voltage part number rating appearing integral @ 50a clearing integral @ 10% rated drop @ rated (ampere) on part (a 2 * sec) @ 50a (a 2 * sec) current (ohms) current (volts) (xx=package code) ac dc ac dc xx/3216FF-250ma .250 .25 .00016 .000084 .00017 .0001 4.50 1.4 xx/3216FF-375ma .375 white dot .001 .0002 .0010 .0009 1.80 .73 xx/3216FF-500ma .500 0.5 .0014 .0019 .0016 .0026 1.15 .66 xx/3216FF-750ma .750 .75 .0033 .00095 .0033 .0042 .75 .63 xx/3216FF-1a 1 1 .012 .007 .014 .009 .168 .20 xx/3216FF-1.5a 1.5 1.5 .047 .029 .048 .034 .098 .18 xx/3216FF-2a 2 2 .116 .081 .136 .092 .063 .16 xx/3216FF-2.5a 2.5 2.5 .208 .171 .210 .198 .046 .14 xx/3216FF-3a 3 3 .426 .359 .507 .369 .037 .13 xx/3216FF-4a 4 4 .187 .164 .208 .168 .019 .11 xx/3216FF-4.5a 4.5 4.5 .546 .463 .550 .47 .014 .10 xx/3216FF-5a 5 5 .663 .619 .668 .623 .013 .09 xx/3216FF-6.5a 6.5 6.5 2.18 3.21 2.21 3.23 .0085 .076 general notes: 1. ac interrupting rating, melting integral and total clearing integral measured at 32v, unity power factor. 2. dc interrupting rating, melting integral and total clearing integral measured at 63v (250ma-3a) and 32v (4-6.5a), with a batter y source. 3. voltage drop measured at 23 3? ambient temperature with the device mounted on a suitable circuit board trace. 4. it is recommended that fuses be mounted with ceramic (white) side facing up. 5. device designed to carry rated current for four hours minimum. an operating current of 80% or less of rated current is recommen ded, with further derating required at elevated ambient temperatures. 6. contact bussmann if higher ampere ratings are needed. .com .com .com 4 .com u datasheet
smt chip fuse 3216FF subminiature surface mount fuses form no. 3216FF page 2 of 2 bif doc #3001 bussmann construction: metal film fusible element (250ma - 6.5a) 123 4 567 1. ceramic substrate 2. glass cover (green) 3. termination pad 4. metal film element drawing is not to scale. 5. silver end termination 6. nickel barrier (3.88 - 4.3 m) 7. 90/10 tin-lead plating (7.6 - 12.7 m) 8. marking 8 e p 2 p 0 p 1 a 0 d 0 f b 0 w 2.50 (0.10) 1.80 (0.07) 1.00 (0.04) carrier dimensions - mm w 8.0 + 0.3 / -0.1 f 3.5 0.05 e 1.75 0.1 p 2 2.0 0.05 p 0 4.0 0.1 p 1 4.0 0.1 a 0 1.73 0.2 b 0 3.56 0.2 d 0 1.5 + 0.1 / -0.0 recommended land pattern - mm (inches) note: trace geometry may affect fuse performance (time-cur- rent characteristics 300% of rated current and voltage drop at rated current). construction r r environmental specifications operating temperature range: -55 to +125?, with proper derating. t hermal shock: mil-std-202, method 107, test condition b (-65 to 125?). vibration: mil-std-202, method 204, test condition c (55 to 2000 h z , 10g). s olderability: withstands 60 seconds above 200?, 260? maximum. moisture resistance: mil-std-202, method 106, 10 day cycle. solder leach resistance & terminal adhesion: eia-576. current in amperes 10 1 .1 .01 .001 time in seconds 10 1 40 current rating .1 750ma 250ma 375ma 500ma 1a 1.5a 2a 2.5a 3a 4a 4.5a 5a time-current characteristic curve (full size curves available) rev. a e99039 9-7-99 .com .com .com 4 .com u datasheet
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